The PCBs for the 3D spherical display are in, and here's a sneak preview of the beginning stages of assembly:

As I get farther into the assembly process (the entire system will use four identical copies of this board) I will attempt to get some action photos detailing my surface mount soldering process. This is my first time soldering a .5mm pitch QFP package (the PIC18LF8722) and I was pleased to find that it wasn't bad at all. The only remaining question mark then is the 8CASON package of the 64Mbit Atmel flash memory (shown at left upside-down next to its final home). It fits an SOIC-8 footprint, but with no width to spare, and it is a leadless package, so there is no pad or lead for me to solder with my iron. I'm optimistic about soldering it with ITP's rumored hot air station, so hopefully tomorrow you will be seeing photos of at least one fully completed board and one smiling student, and maybe a hot-air soldering tutorial from a rookie's perspective.

Otherwise, all is proceeding well. Here's a preview shot of the fantastic frame and support mechanism that my father is currently crafting for the project. This photo is a few days old, and the piece is coming along great. We should be starting to put all the pieces together within the next few weeks. Stay tuned...

Update:

I should also mention that I am trying Kester 331 Water Clean flux and the matching solder for the first time and it is incredible. At the first impression at least, soldering is just as easy as with the standard 44 flux/solder that I have been using for years, but the flux residue comes off the boards with a hot water rinse almost instantly. It's far easier to clean 331 with hot water than it is to clean 44 with acetone and alcohol, and obviously much more appropriate to do so in my apartment. I highly recommend it. Of course it is still leaded solder, so don't forget to wash your hands.